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News / Articles

 
TTM, Inc. adopts Cadence Holistic DFM Solutions for 65nm and Below Designs
April 22nd, 2008
 

Cadence SoC Encounter and Litho Physical Analyzer Optimize Yields and Improve Manufacturability

SAN JOSE, Calif., April 22, 2008

Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic-design innovation, today announced that Time To Market, Inc. (TTM), a leading ASIC design house, was able to detect hot spots and optimize yields for a complex 65-nanometer design using a holistic design-for-manufacturability flow from Cadence that includes the Cadence® SoC Encounter™ XL system and the Cadence Litho Physical Analyzer. The proof-point project provided TTM with state-of-the-art DFM experience and allowed the company to move to Cadence model-based DFM solutions for ongoing 65-nanometer and below designs.

 
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Sagantec and Time To Market team up
November 19th, 2007
 

Sagantec and Time To Market team up to offer design migration solutions

Collaboration enables access to alternate and new process technologies

Fremont, Calif., Nov. 19, 2007 - Sagantec and Time To Market Inc. (TTM) of San Jose, CA, today announced a collaboration to jointly deliver complete integrated circuit (IC) design migration solutions. This program offers a variety of unique strategies for re-implementation of existing designs to new process technologies...

 
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TTM - Expanding in India
January 7th, 2005
 
TTM Will become its third design center, after California and Hyderabad and plans to increase headcount in India to 60 in 3 months.
 
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TTM - Year End News Letter
January 1st, 2004
 
TTM completes one more year in business, and with this it's been five years of successful growth and execution for us.
 
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Cadence Design Systems
September 24, 2003
 
New Cadence Encounter Version 3.2 Reduces Chip Development Time. TTM's expert team of designers relies on Cadence's proven Encounter platform to deliver production silicon.
 
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Chartered Expands Design Services Alliance Program
March 26, 2003
 
TTM provides a very cost effective and risk free route for COT customers, fabricating their ASICS with the leading semiconductor fabs and using IP from different vendors.
 
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TTM / TriCN Announcement
December 17, 2002
 
TTM Signed a strategic partnership with "TriCN" a semiconductor IP Company. Step towards TTM's Efforts to provide a turnkey ASIC Solution to Customers.
 
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TTM's success story
April 07, 2002
 
TTM Tapes out the Largest Chip at Agere Systems and has First-Time Success with Silicon
 
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UMC
July 19, 2001
 
Time To Market Inc. enters into Design Service Agreement with UMC.
http://www.umc.com/
 
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AVANT!
April 17, 2000
 
Grant of Leading Edge Design Software to Custom Engineering Program Continues Avant!'s Worldwide Support of Educational Development.
 
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